Elaris Computing Nexus
Comparative Analysis of Surface Electrical Potential Distribution Across Semiconductor Wafers Using Advanced 3D Simulation Models
Elaris Computing Nexus
Received On : 10 June 2025
Revised On : 30 August 2025
Accepted On : 16 September 2025
Published On : 12 October 2025
Volume 01, 2025
Pages : 170-180
Abstract
Correct mapping of electrical potential using semiconductor wafer is critical to the operation, productivity, and homogeneity of gadgets particularly in the present-day trend in electronics and nearing the nanoscale. Traditional numerical and analysis methods, including Finite Differentiation, Finite Element, Drift Differences, and Poisson Boltzmann algorithms, may be challenging to resolve the fine details around the edges of wafer or high gradients, in contrast to data-driven algorithms, e.g. Neural Network Regression, which are fast without physical insight. To overcome all these shortcomings, this paper suggests a Hybrid Quantum Numerical Model (HQNM), which applies classical numerical computation together with terms of quantum correction to make it more accurate and physical. A set of six surface potential simulations of this model was compared to five known methods with the same boundary and material conditions. Findings indicate that HQNM has the best root mean square error, smoothness factor and correct edge performance at moderate cost of computation. The results demonstrate that the model is a promising approach to high-fidelity wafer-level potential mapping, a balanced solution to offer numerically stable, accurate, and computationally-efficient solutions.
Keywords
Semiconductor Wafer, Electrical Potential Mapping, Hybrid Quantum-Numerical Model, Surface Potential Simulation, Finite Difference and Finite Element.
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CRediT Author Statement
The authors confirm contribution to the paper as follows:
Conceptualization: Aaron Maurer; Methodology: Minu Balakrishnan; Software: Aaron Maurer and Minu Balakrishnan; Writing- Original Draft Preparation: Minu Balakrishnan; Investigation: Aaron Maurer and Minu Balakrishnan; Supervision: Minu Balakrishnan; Writing- Reviewing and Editing: Aaron Maurer and Minu Balakrishnan; The author reviewed the results and approved the final version of the manuscript.
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Cite this Article
Aaron Maurer and Minu Balakrishnan, “Comparative Analysis of Surface Electrical Potential Distribution Across Semiconductor Wafers Using Advanced 3D Simulation Models”, Elaris Computing Nexus, pp. 170-180, 2025, doi: 10.65148/ECN/2025016.
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© 2025 Aaron Maurer and Minu Balakrishnan. This is an open access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.